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? 2015-2016 microchip technology inc. ds60001372d-page 1 bm70/71 features bluetooth sig 4.2 qualified certified to fcc, ic, mic, kcc, ncc and srrc radio regulations european r&tte directive assessed radio mod- ule rohs compliant uart, i 2 c, and spi interface supported supports transparent uart data service of ble built around microchip is187x soc bm70 supports 3-channel pwm and bm71 sup- ports 1-channel pwm precision temperature sensor (pts) with operating range of -20c ~ +70c with an accuracy of 3c 12-bit adc (enob=10/8-bits) support for battery and voltage detection. 8-channel adc for bm70 and 5-channel adc for bm71 is provided 18 general purpose i/o pins (bm70) and 9 gen- eral purpose i/o pins (bm71) integrated 32 mh z crystal small and compact surface mount module castellated smt pads for easy and reliable pcb mounting rf features ism band 2.402 ghz to 2.480 ghz operation channels: 0-39 receive sensitivity: typical -90 dbm (le) transmit power: 0 dbm (typical) received signal strength indication (rssi) monitor with 1 db resolution mac/baseband/higher layer features secure aes128 encryption gap, gatt, sm, l2cap and integrated public profile create custom services using user interface (ui) tool, a windows ? configuration utility i/o capability for bt4.0/bt4.2 authentication software configurable role as peripheral/central, client/server antenna integrated chip antenna (bm7xbles1fc2) external antenna connection through rf pad (bm7xble01fc2) power management low-power modes supported, system wake-up through any gpio peak current: tx 13 ma and rx 13 ma with buck at 3.0v v bat input operating conditions operating voltage range: 1.9v to 3.6v operating temperature: -20oc to +70oc note: these images are for the representation purpose only and the original product might differ in markings. bluetooth ? low energy (ble) module
bm70/71 ds60001372d-page 2 ? 2015-2016 microchip technology inc. general description the bm70/71 module offers bluetooth low energy solution for embedded applications. it conforms to the bluetooth core specification version 4.2 to enhance the throughput and security for the iot applications. it also supports beacon technology to enhance user experi- ence for the iot applications and enables users to con- trol the cloud and receive data without opening the application through a smart phone. the bm70/71 has bluetooth stack integrated and is available in different form factor to optimize the space, cost, and rf performance. for portable and wearable applications, it provides power-optimized design to minimize the current consumption to extend the battery life. applications internet of things (iot) payment or security wearable devices home and security health and fitness beacons industrial and data logger
? 2015-2016 microchip technology inc. ds60001372d-page 3 bm70/71 table of contents 1.0 device overview .............................................................................. .............................. .................................................................. 5 2.0 application information.................................................. .................................................. ............................................................... 13 3.0 module configuration .............................................. ......................................................... .............................................................. 25 4.0 antenna................................................ ................................................... ................. ...................................................................... 27 5.0 electrical characteristics..................................................... ............................................ ............................................................... 35 6.0 packaging information ................................................................... ................................................................................................ 41 7.0 soldering recommendations ......................................................... ......................................... ....................................................... 49 8.0 ordering guide .......................................................................... ................................... ................................................................. 51 appendix a: certification notices....................................... ................................................... .... ........................................................... 53 appendix b: revision history.......................................... ................................................... ...... ............................................................ 59 to our valued customers it is our intention to provide our valued customers with the best documentation possible to ensure successful use of your micro chip products. to this end, we will continue to improve our publications to better suit your needs. our publications will be refined and enhanced as new volumes and updates are introduced. if you have any questions or comments regar ding this publication, please contact the marketing communications department via e-mail at docerrors@microchip.com or fax the reader response form in the back of this data sheet to (480) 792-4150. we welcome your feedback. most current data sheet to obtain the most up-to-date version of this data s heet, please register at our worldwide web site at: http://www.microchip.com you can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page . the last character of the literature number is the versi on number, (e.g., ds30000000a is ve rsion a of document ds30000000). errata an errata sheet, describing minor operational differences fr om the data sheet and recommended workarounds, may exist for curren t devices. as device/documentation i ssues become known to us, we will publish an errata sheet. the errata will specify the revisi on of silicon and revision of document to which it applies. to determine if an errata sheet exists for a particul ar device, please check with one of the following: microchips worldwide web site; http://www.microchip.com your local microchip sales office (see last page) when contacting a sales office, please spec ify which device, revision of silicon and data sheet (include literature number) you are using. customer notification system register on our web site at www.microchip.com to receive the most current information on all of our products.
bm70/71 ds60001372d-page 4 ? 2015-2016 microchip technology inc. notes:
? 2015-2016 microchip technology inc. ds60001372d-page 5 bm70/71 1.0 device overview the bm70/71 embedded 2.4 ghz bluetooth version 4.2 ble module is built around microchip technology is1870/71 ble system on chip (soc). the is1870/71 soc incorporates bluetooth stack, power management subsystem, 2.4 ghz transceiver, and rf power ampli- fier. the user can embed bluetooth functionality into any applications using the bm70/71 module. the bm70/71 enables faster product development and time to market. it is designed to provide simple bluetooth solutions with the following features: simple integration and programming reduced development time superior wireless module with low-cost system interoperability with apple ? ios and android? os wide range of applications in addition, the bm70/71 supports beacon technology to improve user experiences in iot applications, such as auto connection/control and data to cloud. the bm70/71 can independently maintain a low-power wireless connection, and the low-power usage and flex- ible power management maximizes the modules lifetime in battery operated devices. also, wide operating tem- perature range enables its use in indoor and outdoor environments. the bm70/71 is a small, compact, surface mount on the host pcb with the castellated pads making the interface easy and reliable. the bm71 is relatively small form fac- tor module targeted for applications, such as wearable sports, fitness devices and so on. 1.1 interface description figure 1-1 and figure 1-2 illustrate an example of the bm70/71 module-based system. figure 1-3 through figure 1-6 illustrate the pin diagrams. table 1-1 provides pin descriptions. figure 1-1: bm70-based system block diagram
bm70/71 ds60001372d-page 6 ? 2015-2016 microchip technology inc. figure 1-2: bm71-based system block diagram
? 2015-2016 microchip technology inc. ds60001372d-page 7 bm70/71 figure 1-3: bm70ble0 1fc2 pin diagram figure 1-4: bm70bles 1fc2 pin diagram
bm70/71 ds60001372d-page 8 ? 2015-2016 microchip technology inc. figure 1-5: bm71ble0 1fc2 pin diagram figure 1-6: bm71bles 1fc2 pin diagram
? 2015-2016 microchip technology inc. ds60001372d-page 9 bm70/71 table 1-1: pin description bm70ble0 1fc2 bm70ble s1fc2 bm71ble 01fc2 bm71ble s1fc2 pin name type description 1 gnd power ground reference 2 gnd power ground reference 1 3 12 13 gnd power ground reference 241 11 4v bat power battery input. voltage range: 1.9v to 3.6v 10 bk_in power buck input. voltage range: 1.9v to 3.6v 3 5 p2_2 dio gpio, default pull-high input pwm1 46 v dd _io power i/o positive supply. do not connect. ensure v dd _io and mcu i/o voltage are compatible 57 v dd _io power i/o positive supply. do not connect. ensure v dd _io and mcu i/o voltage are compatible 6 8 ulpc_o power 1.2v programmable ulpc ldo output for aon-logic and retention memory sup- ply. internal use only, do not connect to other devices. 7 9 p2_3 di gpio, default pull-high input pwm2 8 10 bk_o power 1.55v buck output. internal use only, do not connect to other devices. 13 6 p1_6 dio ai p1_6 external 32.768 khz crystal input: xi32k 14 5 p1_7 dio ao p1_7 external 32.768 khz crystal output: xo32k 91 11 51 5p 2 _ 7 dio ai dodo gpio: p2_7 adc input: ad14 tx_ind spi bus: ncs2, second spi bus (master mode) 10 12 p1_1 dio ai di gpio: p1_1 adc input: ad9 spi bus: miso2, second spi bus (master mode) 11 13 2 3 p1_2 dio ai i/o gpio, default pull-high input ad10 i 2 c scl 12 14 3 4 p1_3 dio ai dio gpio, default pull-high input ad11 i 2 c sda 13 15 8 11 p0_0 dio ai di gpio, default pull-high input ad0 uart flow-control cts 14 16 p1_0 dio ai gpio, default pull-high input ad8 15 17 6 9 p3_6 dio dodo gpio, default pull-high input pwm0 uart flow-control rts legend: a = analog d = digital i = input o = output
bm70/71 ds60001372d-page 10 ? 2015-2016 microchip technology inc. 16 18 16 16 p2_0 di system configuration, default pull-high input h: application mode l: test mode 17 19 p2_4 dio gpio, default pull-high input 18 20 nc no connection 19 21 7 10 rst_n di module reset (active-low) (internal pull-up) 20 22 5 7 hci_rxd di hci uart data input 21 23 4 8 hci_txd do hci uart data output 22 24 p3_1 dio do gpio: p3_1 spi bus: ncs, spi flash: csn 23 25 p3_2 dio do gpio: p3_2 spi bus: miso, spi flash: sdo 24 26 p3_3 dio di gpio: p3_3 spi bus: mosi, spi flash: sdi 25 27 p3_4 dio do gpio: p3_4 spi bus: sclk, spi flash: sck 26 28 p3_5 dio do gpio, default pull-high input led1 27 29 p0_7 dio ai gpio, default pull-high input ad7 28 30 9 12 p0_2/led dio ai p02ad2 29 31 17 2 gnd power ground reference 32 gnd power ground reference 30 1 1 bt_rf ai external antenna connection (50 ohm) only for bm70ble01fc2 and bm71ble01fc2 nc for bm71bles1fc2 33 gnd power ground reference legend: a = analog d = digital i = input o = output bm70ble0 1fc2 bm70ble s1fc2 bm71ble 01fc2 bm71ble s1fc2 pin name type description
? 2015-2016 microchip technology inc. ds60001372d-page 11 bm70/71 table 1-2 provides the bm70/71 and ble development kit version 3 (bledk3) features. table 1-2: bm70/71 hardware and bledk3 features (1) note 1: the gpio, adc and pwm pin numbers in the bledk3 application is calculated by taking out the default pins of uart peripherals and led indication, which are listed in ta b l e 1 - 4 . 2: for detailed gpio configuration example for the bledk3 manual pattern, refer to the " bledk3 manual pattern user?s guide . note: the bledk3 application is one of the application firmwares of the bm70/71. for more information on the bledk3 applica- tion, refer to the is187x_bm7x bledk3 application note . feature/ modules bm70bles1fc2 bm70b le01fc2 bm71bles1 fc2 bm71ble01fc2 configuration module h/w bledk3 module h/w bledk3 module h/w bledk3 module h/w bledk3 uart 1 1 1 1 1 1 1 1 gpio (see note 2 )1 8 1 3 1 8 1 3 9 4 9 4 12-bit adc channels 8 6 8 6 5 3 5 3 pwm 3 2 3 2 1 0 1 0 spi 2 0 2 0 1 0 1 0 i 2 c1 0 1 0 1 0 1 0 total pins 33 30 16 17 on-board antenna with shielded can yes yes no antenna yes yes government regula- tory rf certified yes yes size (mm) 12x22x2.4 12x15x1.6 9x11.5x2.1 6x8x1.6
bm70/71 ds60001372d-page 12 ? 2015-2016 microchip technology inc. table 1-3 provides the details of the test pads used for the production test on the bottom of the bm70/71. table 1-4 provides gpio pins and its connection details. table 1-3: test pads details table 1-4: gpio pin details bm70ble 01fc2 bm70ble s1fc2 bm71ble 01fc2 bm71ble s1fc2 pin name type description tp-1 tp-1 tp-3 tp-3 v cc _pa power 1.55v rf pa ldo tp-2 tp-2 tp-1 tp-1 cldo_o power 1.2v cldo output tp-3 tp-3 tp-2 tp-2 v cc _rf power 1.28v rf ldo output tp-4 tp-4 ulpc_o power 1.2v ulpc ldo output tp-5 tp-5 bk_o power 1.55v buck output gpio pins connection details p2_0 system configuration p0_2 led0 p0_0 uart_cts p2_7 uart_rx_ind p3_6 uart_rts
? 2015-2016 microchip technology inc. ds60001372d-page 13 bm70/71 2.0 application information 2.1 reference schematics figure 2-1 through figure 2-4 illustrate the bm70/71 reference circuits for various stock keeping units (skus). the gpios are configurable and the connec- tion depends on the users application circuit. the power input range is 1.9v~3.6v. if the battery is used, the battery reverse protection circuit is recommended. the v dd _io voltage is same as power input. if the led is used, ensure that the voltage is more than 3v to drive the led. a 1.8v reset ic is added as an optional circuit to prevent the flash data crash when v bat power is unstable. it is recommended to implement the rf antenna matching circuit as illustrated in figure 2-3 and figure 2-5 to fine tune the antenna impedance matching. figure 2-1: bm70bles1fc2 reference circuit figure 2-2: bm70bles1fc2 reference circuit
bm70/71 ds60001372d-page 14 ? 2015-2016 microchip technology inc. figure 2-3: bm70ble01fc2 reference circuit figure 2-4: bm70ble01fc2 reference circuit
? 2015-2016 microchip technology inc. ds60001372d-page 15 bm70/71 figure 2-5: bm71ble01fc2 reference circuit note 1: place the capacitor c3 as close as possible to the module. connect the bk_in and v bat trace at c3. 2: the antenna matching component value depends on the users antenna and pcb layout. figure 2-6: bm71ble01fc2 reference circuit
bm70/71 ds60001372d-page 16 ? 2015-2016 microchip technology inc. figure 2-7: bm71bles1fc2 reference circuit note 1: place the capacitor c3 as close as possible to the module. figure 2-8: bm71bles1fc2 reference circuit - optional
? 2015-2016 microchip technology inc. ds60001372d-page 17 bm70/71 2.2 external configuration and programming the bm70/71 can be configured and programmed using an external configuration and programming tool. figure 2-9 illustrates the test points that must be included on the host pcb for the development. configuration and programming modes can be entered according to the system configuration i/o pins. for additional information, refer to section 3.4, system configuration . figure 2-9: external conf iguration and programming
bm70/71 ds60001372d-page 18 ? 2015-2016 microchip technology inc. 2.3 host mcu interface 2.3.1 host mcu interface over uart figure 2-10 and figure 2-11 illustrate the bm70/71 to host mcu interface over uart. the host control inter- face (hci) uart lines are used to communicate between the bm70/71 and mcu. the interface also illustrates the power scheme using a 3.3v low-drop out (ldo) regulator that supply 3.3v to the bm70/71 (bat_in) and mcu v dd . this power scheme ensures that the bm70/71 and mcu i/o voltages are compati- ble. figure 2-10: bm70 to mcu interface note 1: ensure that v bat (=i/o voltage) and mcu v dd voltages are compatible. 2: control and indication ports are configurable.
? 2015-2016 microchip technology inc. ds60001372d-page 19 bm70/71 figure 2-11: bm71 to mcu interface note 1: ensure that v bat =i/o voltage) and mcu v dd voltages are compatible. 2: control and indication ports are configurable. 3: 10 f (x5r) and 330 ohm resistor are required for the bm71 module. 4: bk_in connect to v bat for bm71ble01fc2.
bm70/71 ds60001372d-page 20 ? 2015-2016 microchip technology inc. 2.3.2 uart ready after external reset in mcu applications, the time between reset/power-on and the bm70/71 uart port read must be notified. figure 2-12 illustrates the timing of the bm70/71 uart port ready for test mode and application mode after reset. figure 2-12: timing diagram of bm70/71 uart ready for test mode after reset
? 2015-2016 microchip technology inc. ds60001372d-page 21 bm70/71 2.3.3 uart ready after power-on reset figure 2-13 illustrates the timing of the bm70/71 uart port ready for test mode and application mode after power-on reset (por). in application mode, when the bm70/71 is ready to communicate with the host mcu after reset, the bm70/71 will have either standby mode which is indi- cated by the status pin, or a status report uart com- mand which is sent to inform the mcu that the bm70/71 is ready for communication. figure 2-13: timing diagram of bm70 uart ready for test mode after power on
bm70/71 ds60001372d-page 22 ? 2015-2016 microchip technology inc. 2.4 standalone configuration figure 2-14 illustrates the standalone configuration for the bm71ble01fc2 module. it also illustrates an application using a coin cell battery at v bat input. for the bm71, a 10 f capacitor (x5r/x7r) is applied to the bat_in pin. the bk_in pin of the bm71ble01fc2 module must be connected to the bat_in pin. figure 2-14: bm71 st andalone configuration note 1: applications include adc, pwm (bm71), i 2 c, and spi bus interface.
? 2015-2016 microchip technology inc. ds60001372d-page 23 bm70/71 2.5 power-drop protection to prevent the bm70/71 from disruptions, when the voltage drops to less than 1.9v, an open drain reset chip with a delay time of 10 ms that triggers reset at 1.8v output voltage is recommended. figure 2-15 illus- trates the reset circuit block diagram. figure 2-15: reset circuit block diagram
bm70/71 ds60001372d-page 24 ? 2015-2016 microchip technology inc. notes:
? 2015-2016 microchip technology inc. ds60001372d-page 25 bm70/71 3.0 module configuration the bm70/71 features and services can be configured using the windows ui configuration tool. for additional information, refer to the windows ui configuration tool user?s guide . 3.1 uart interface the bm70/71 uart pins, txd and rxd, are con- nected to the uart pins of the host mcu. it is recom- mended to use hardware flow control pins, rts and cts. by default, the bm70/71 hardware flow control is disabled, and users must configure the pin to enable the same. the uart baud rate is configurable. 3.2 control and indication i/o pins the i/o pins on the bm70/71 are configurable as either control or indication signal. t h e control signals are input to the bm70/71 and the indication signals are out- put from the bm70/71. table 3-1 provides configurable i/o pin assignment details to control and indication sig- nals of bm70 bledk3 (ble development kit v3). for different bm70/71 applications, the i/o pin assignment is different. for additional information related to i/o pin assignment, refer to the windows ui configuration tool user guide of each bm70/71 application firmware. . table 3-1: conf iguration and indicatio n i/o assignments for bm70 bledk3 applications pins n/c low_battery_ind rssi_ind link_drop uart_rx_ind pairing_key rf_active_ind bledk_status1_ind (*note) bledk_status2_ind (*note) p1_0 default p3_1 default p3_2 default p3_3 default p3_4 default p0_7 default p1_1 default p2_2 default p2_4 default p3_5 default note: for additional information on the bledk application status, refer to the bledk3 release notes .
bm70/71 ds60001372d-page 26 ? 2015-2016 microchip technology inc. table 3-2 provides pin assignment details for the bm70 bledk3 application. table 3-2: pin assignment fo r bm70 bledk3 application 3.3 reset (rst_n) the reset input pin (rst_n) is used to reset the bm70/71 with an active-low pulse with a minimum pulse width of 63 ns. 3.4 system configuration table 3-3 provides the system configuration settings of the p2_0 pin that places the bm70/71 into operation modes. the p2_0 pin has an internal pull-up. table 3-3: system co nfiguration settings pin name pin assignment p3_6 uart_rts p0_0 uart_cts p2_7 tx_ind p1_2 i 2 c_scl p1_3 i 2 c_sda p0_2 led0 p2_0 operational mode high application mode low test mode (write ui/flash: firmware programming)
? 2015-2016 microchip technology inc. ds60001372d-page 27 bm70/71 4.0 antenna 4.1 antenna characteristics 4.1.1 bm70bles1fc2 ceramic chip antenna the bm70bles1fc2 module contains an inbuilt ceramic chip antenna. the antenna performance of the bm70bles1fc2 is shown in figure 4-1 . table 4-1 provides the antenna characteristics of the bm70bles1fc2 module. figure 4-1: bm70bles1fc2 antenna radiation pattern table 4-1: bm70bles1fc2 antenna characteristics parameter values frequency 2450 mhz peak gain 1.63 dbi efficiency 71.55%
bm70/71 ds60001372d-page 28 ? 2015-2016 microchip technology inc. 4.1.2 bm71bles1fc2 ceramic chip antenna the bm71bles1fc2 module contains an inbuilt ceramic chip antenna. the antenna performance of the bm71bles1fc2 module is shown in figure 4-2 . table 4-2 provides the bm71bles1fc2 antenna char- acteristics. figure 4-2: bm71bles1fc2 antenna radiation pattern table 4-2: bm71bles1fc2 antenna characteristics parameter values frequency 2442 mhz peak gain 0.1 dbi efficiency 42.7%
? 2015-2016 microchip technology inc. ds60001372d-page 29 bm70/71 4.2 antenna placement for a bluetooth wireless product, antenna placement affects the whole system performance. the antenna needs free space to transmit rf signals and cannot be surrounded by the gnd plane. figure 4-3 and figure 4-4 illustrate a typical example of the antenna placement on the main application board with ground plane. figure 4-3: bm70bles1fc2 ant enna placement recommendation
bm70/71 ds60001372d-page 30 ? 2015-2016 microchip technology inc. figure 4-4: bm71bles1fc2 ant enna placement recommendation
? 2015-2016 microchip technology inc. ds60001372d-page 31 bm70/71 4.3 host pcb mounting suggestion 4.3.1 bm70bles1fc2 host pcb mounting figure 4-5 illustrates the host pcb mounting sugges- tions for the bm70bles1fc2 module, and it shows minimum ground plane area to the left and right of the module for best antenna performance. while designing the host pcb, the area under the antenna should not contain any top, inner, or bottom copper layer. a low-impedance ground plane ensures the best radio performance (best range, low noise). the ground plane can be extended beyond the mini- mum recommended as required for the host pcb emc noise reduction. for best range performance, keep all external metal away by minimum 30 mm from the ceramic chip antenna. figure 4-5: bm70bles1fc2 ho st pcb mounting suggestion
bm70/71 ds60001372d-page 32 ? 2015-2016 microchip technology inc. 4.3.2 bm70ble01fc2 host pcb mounting figure 4-6 illustrates the mounting suggestions for the bm70ble01fc2 module and it also shows a connec- tion to ufl connector. a low-impedance ground plane will ensure the best radio performance (best range, low noise). the pin_30 (bt_rf) is connected to an external antenna connector, a pcb trace antenna, or a compo- nent (ceramic chip) antenna through a host pcb 50 ohm micro-strip trace. the micro-strip trace can be extended to include passive parts for antenna attenua- tion padding, impedance matching, or to provide test points. it is recommended that the micro-strip trace be as short as possible for minimum loss and best imped- ance matching. if the micro-strip trace is longer, it should be a 50 ohm controlled impedance. figure 4-6: bm70ble0 1fc2 host pcb mounting suggestions
? 2015-2016 microchip technology inc. ds60001372d-page 33 bm70/71 4.3.3 bm71bles1fc2 host pcb mounting figure 4-7 illustrates the mounting suggestions for the bm71bles1fc2 module. it also shows the area around the antenna required for the best antenna per- formance. the area under the antenna should not contain any top, inner, or bottom copper layer when designing the host pcb. a low-impedance ground plane ensures the best radio performance (best range, low noise). the ground plane can be extended beyond the minimum recom- mended as required for the host pcb emc noise reduction. for best range performance, keep all exter- nal metal away by minimum 30 mm from the ceramic chip antenna. figure 4-7: bm71bles1fc2 host mounting suggestion
bm70/71 ds60001372d-page 34 ? 2015-2016 microchip technology inc. 4.3.4 bm71ble01fc2 host pcb mounting figure 4-8 illustrates the mounting suggestions for the bm71ble01fc2 module. it also shows a connection to the ufl connector. a low-impedance ground plane will ensure the best radio performance (best range, low noise). the pin_1 (bt_rf) is connected to an external antenna connector, a pcb trace antenna, or a compo- nent (ceramic chip) antenna through a host pcb 50 ohm micro-strip trace. the micro-strip trace can be extended to include passive parts for antenna attenua- tion padding, impedance matching, or to provide test posts. it is recommended that the micro-strip trace be as short as possible for minimum loss and best imped- ance matching. if the micro-strip trace is longer, it should be 50 ohm controlled impedance. figure 4-8: bm71ble01fc2 ho st pcb mounting suggestion
? 2015-2016 microchip technology inc. ds60001372d-page 35 bm70/71 5.0 electrical characteristics this section provides an overview of the bm70/71 modules electrical characteristics. additional informatio n will be provided in future revisions of this document. absolute maximum ratings for the bm70/71 devices are listed here. exposure to the maximum rating conditi ons for extended periods may affect device reliability. functional operation of the device at these or any other co nditions, above the parameters indicated in the operation listings of this specification, is not implied. 5.1 absolute maximum ratings (see note 1) ambient temperature under bias................................................................................................. ............. .-20c to +70c storage temperature ............................................................................................................ .................. -40c to +125c voltage on v dd with respect to v ss ......................................................................................................... -0.3v to +3.6v voltage of any digital pin .................................................................................................... ........-0.3v to v dd + 0.3 3.9 maximum output current sunk by any i/o pin..................................................................................... .....................12 ma maximum output current sourced by any i/o pin.................................................................................. ..................12 ma note 1: stresses above those listed under ?absolute maximum ratings? may cause permanent damage to the device. this is a stress rating only and functional operation of the device at those or any other conditions, above those indicated in the operation listings of this specification, is not implied. exposure to maximum rating conditions for extended periods may affect device reliability.
bm70/71 ds60001372d-page 36 ? 2015-2016 microchip technology inc. table 5-1: recommended operating conditions symbol min. typ. max. ambient operating temperature range C20c +25c +70c pmu v dd (v bat , bk_in), av dd 1.9v 3.0v 3.6v rst_n 1.9v 3.0v 3.6v other i/os 1.9v 3.6v gpio v ih (input high voltage) 0.7 v dd v dd v il (input low voltage) v ss 0.3 v dd v oh (output high voltage) (high drive, 12 ma) 0.8 v dd v dd v ol (output low voltage) (high drive, 12 ma) v ss 0.2 v dd pull-up resistance 34k 48k 74k pull-down resistance 29k 47k 86k supply current tx mode peak current at v dd =3v, tx=0dbm, buck mode 1 3 m a rx mode peak current at v dd =3v, buck mode 13 ma link static current 60 a standby current 1.9 a2 . 9 a power-saving 1 a1 . 7 a analog to digital converter (adc) full scale (bat_in) 0v 3.0v 3.6v full scale (ad0~ad15) 0v 3.6v conversion time (enob 8-bit) 131 s conversion time (enob 10-bit) 387 s operating current 500 a dnl -1.12 lsb +1.12 lsb inl -4.38 lsb +4.38 lsb precise temperature sensor (pts) detect range -20c +70c digital output 1387 2448 resolution 12-bit/c accuracy -3c +3c conversion time (enob 10-bit) 12.35 ms operating current 200 a
? 2015-2016 microchip technology inc. ds60001372d-page 37 bm70/71 5.2 current consumption details 5.2.1 tx/rx current consumption details figure 5-1 and figure 5-2 illustrate the tx/rx peak and average current consumption of an advertising event in the bledk3 beacon mode application. the peak current consumption of the v bat input is 12 ma and the average current consumption is around 0.23 ma. in this example the advertising interval is 100 ms. current consumption is measured at 3.3v v bat input. figure 5-1: tx/rx peak current consumpt ion of advertising event in bledk3 beacon mode
bm70/71 ds60001372d-page 38 ? 2015-2016 microchip technology inc. figure 5-2: tx/rx average current co nsumption of advertising event in bledk3 beacon mode for additional information on the current consumption measurements, test conditions, and test environment setups in the bledk3 application, refer to the is187x_bm7x bledk3 application note . this appli- cation note covers the detailed information about sta- tus of bledk3 application. ta b l e 5 - 2 provides the status and description of the bledk3 application. table 5-2: status of ble dk3 application example note 1: client characteristic configuration (cccd) is the generic attribute profi le (gatt) service characteristics. status description shutdown mode bledk3 is shutdown. standby mode bledk3 sends advertising packets and wait for connection. bledk3 is discoverable and connectible. ble connected mode ble link is established and cccd of issc_transparent_tx char acteristic is disabled (see note 1 ). transparent service enabled mode ble link is established and cccd of issc_tran sparent_tx characteristic is enabled (see note 1 ).
? 2015-2016 microchip technology inc. ds60001372d-page 39 bm70/71 note 1: test condition: v bat =3.3v, led set off and measured in v bat input. 2: flash code version: bledk3 v1.03, ui version: is187x_102_bledk3_uiv100.123. 3: test phone: iphone ? 6+ with ios 9.02. 4: test application version: bledk3 v1.2. 5: ui set flow control and rx_ind. 6: for information on how to measure the current, refer to the ?is187x_bm7x bledk3 application note? . table 5-3: bm70ble01fc2 applicat ion mode current consumption ( 1,2,3,4,5,6 ) test mode/test condition average current consumption note standby mode advertising interval: 100 ms 0.23 ma ui: set as beacon advertising interval: 500 ms 0.077 ma ui: set as beacon ble connected mode (no data exchange) connection interval: 500 ms slave latency: 2 0.08 ma measured when transparent page is open on the bledk3 applica- tion. transparent service enable mode tx data connection interval: 18.75 ms slave latency: 0 3.87 ma maximum tx data throughput set- ting tested file size: 100 kb tx data throughput: 9.863 kb/s transparent service enable mode tx data connection interval: 40 ms slave latency: 0 2.77 ma tested file: 100 kb tx data throughput: 4.676 kb/s transparent service enable mode rx data connection interval: 18.75 ms slave latency: 0 3.06 ma (write with response) 3.9 ma (write with reliable burst transmit) maximum rx data throughput set- ting tested file size: 100 kb throughput: 4.956 kb/s (write with response) 9.382 kb/s (write with reliable burst transmit) transparent service enable mode tx data connection interval: 40 ms slave latency: 0 2.14 ma (write with response) 3.03 ma (write with reliable burst transmit) tested file size: 100 kb throughput: 2.494 kb/s (write with response) 5.056 kb/s (write with reliable burst transmit) shut down mode 1.44 a
bm70/71 ds60001372d-page 40 ? 2015-2016 microchip technology inc. notes:
? 2015-2016 microchip technology inc. ds60001372d-page 41 bm70/71 6.0 packaging information 6.1 bm70bles1fc2 figure 6-1 illustrates the bm70bles1fc2 dimensions and figure 6-2 illustrates the recommended pcb foot- print. ensure that no top copper layer is near the test pin area. figure 6-1: bm70bles1f c2 module dimensions
bm70/71 ds60001372d-page 42 ? 2015-2016 microchip technology inc. figure 6-2: bm70bles1fc2 recommended pcb footprint
? 2015-2016 microchip technology inc. ds60001372d-page 43 bm70/71 6.2 bm70ble01fc2 figure 6-3 illustrates the bm70ble01fc2 dimensions and figure 6-4 illustrates the recommended pcb footprint. figure 6-3: bm70ble01f c2 module dimensions
bm70/71 ds60001372d-page 44 ? 2015-2016 microchip technology inc. figure 6-4: bm70ble01fc2 re commended pcb foot print
? 2015-2016 microchip technol ogy inc. ds60001372d-page 45 bm70/71 6.3 bm71bles1fc2 figure 6-5 illustrates the bm71bles1fc2 dimensions and figure 6-6 illus- trates the recommended pcb footprint. ensure that no top copper layer is near the test pin area. figure 6-5: bm71bles1f c2 module dimensions
bm70/71 ds60001372d-page 46 ? 2015-2016 microchip technology inc. figure 6-6: bm71bles1fc2 recommended pcb footprint
? 2015-2016 microchip technol ogy inc. ds60001372d-page 47 bm70/71 6.4 bm71ble01fc2 figure 6-7 illustrates the bm71ble01fc2 dimensions and figure 6-8 illus- trates the recommended pcb footprint. figure 6-7: bm71ble01f c2 module dimensions
bm70/71 ds60001372d-page 48 ? 2015-2016 microchip technology inc. figure 6-8: bm71ble01fc2 recommended pcb footprint
? 2015-2016 microchip technology inc. ds60001372d-page 49 bm70/71 7.0 soldering recommendations the bm70/71 should be assembled using a standard lead-free, re-flow profile ipc/jedec j-std-020. the module can be soldered to the host pcb using a stan- dard lead or lead-free solder re-flow profiles, see figure 7-1 . to avoid any damage to the bm70/71, follow these rec- ommendations: do not exceed the peak temperature (t p ) of +250 ? c use no-clean flux solder paste do not wash as moisture can be trapped under the shield use only one flow. if pcb requires multiple flows, apply the module on the final flow. for additional information on solder re-flow recommen- dations, refer to the solder re-flow recommendation application note (ds00233), which is available for download from the microchip web site at: http://www.microchip.com. figure 7-1: re -flow profile
bm70/71 ds60001372d-page 50 ? 2015-2016 microchip technology inc. notes:
? 2015-2016 microchip technology inc. ds60001372d-page 51 bm70/71 8.0 ordering guide table 8-1 provides the ordering information for the bm70/71 module. table 8-1: bm70/71 module variants module microchip ic description antenna shield pin # regulatory certification part number bm70 is1870sf bt4.2 ble module, 12 mm x 15 mm x 1.6 mm external no 30 no bm70ble01fc2 bm70 is1870sf bt4.2 ble module, 12 mm x 22 mm x 2.4mm on board yes 33 fcc, ic, ce, mic, kcc, ncc, srrc bm70bles1fc2 bm71 is1871sf bt4.2 ble module, 6 mm x 8 mm x 1.6 mm external no 17 no bm71ble01fc2 bm71 is1871sf bt4.2 ble module, 9 mm x 11.5 mm x 2.1 mm on board yes 16 fcc, ic, ce, mic, kcc, ncc bm71bles1fc2 note: the bm70/71 can be purchased by con- tacting your local microchip sales office (see last page). for pricing and a list of distributors, visit microchip web site: http://www.microchip.com and for a list of latest certifications visit www.micro- chip.com/ wireless.
bm70/71 ds60001372d-page 52 ? 2015-2016 microchip technology inc. notes:
? 2015-2016 microchip technology inc. ds60001372d-page 53 bm70/bm71 appendix a: certification notices the bm70 module (bm70bles1fc2) has received the regulatory approval for the following: bt sig/qdid:74246 united states/fcc id: a8tbm70abcdefgh canada - ic id: 12246a-bm70bles1f2 - hvin: bm70bles1f2 europe/ce japan/mic: 202-smd069 korea/kcc: msip-crm-mcp-bm70bles1fc2 taiwan/ncc no: ccan15lp0500t1 china/srrc: cmiit id: 2015dj7135 the bm71 module (bm71bles1fc2) has received the regulatory approval for the following: bt sig/qdid:74246 united states/fcc id: a8tbm71s2 canada - ic id: 12246a-bm71s2 - hvin: bm71bles1fc2 europe/ce japan/mic: 005-101150 korea/kcc: msip-crm-mcp-bm71bles1fc2 taiwan/ncc no: ccan16lp0010t5 a.1 regulatory approval this section outlines the regulatory information for the bm70/bm71 for the following countries: united states canada europe japan korea taiwan china other regulatory jurisdictions a.1.1 united states the bm70/bm71 has received federal communica- tions commission (fcc) cfr47 telecommunications, part 15 subpart c "intentional radiators" modular approval in accordance with part 15.212 modular transmitter approval. modular approval allows the end user to integrate the bm70/bm71 into a finished prod- uct without obtaining subsequent and separate fcc approvals for intentional radiation, provided no changes or modifications are made to the module cir- cuitry. changes or modifications could void the user's authority to operate the equipment. the end user must comply with all of the instructions provided by the grantee, which indicate installation and/or operating conditions necessary for compliance. the finished product is required to comply with all appli- cable fcc equipment authorizations regulations, requirements and equipment functions not associated with the transmitter module portion. for example, com- pliance must be demonstrated to regulations for other transmitter components within the host product; to requirements for unintentional radiators (part 15 sub- part b "unintentional radiators"), such as digital devices, computer peripherals, radio receivers, etc.; and to additional authorization requirements for the non-transmitter functions on the transmitter module (i.e., verification, or declaration of conformity) (e.g., transmitter modules may also contain digital logic func- tions) as appropriate. a.1.2 labeling and user information requirements the bm70/bm71 has been labeled with its own fcc id number, and if the fcc id is not visible when the mod- ule is installed inside another device, then the outside of the finished product into which the module is installed must also display a label referring to the enclosed module. this exterior label can use wording as follows: for the bm70: for the bm71: on the bm71, due to the limited module size (9.0 mm x 11.5 mm), the fcc identifier is displayed in the data sheet only and it can not be displayed on the module label. contains transmitter module fcc id:a8tbm70abcdefgh or contains fcc id: a8tbm70abcdefgh this device complies with part 15 of the fcc rules. operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation contains transmitter module fcc id: a8tbm71s2 or contains fcc id: a8tbm71s2 this device complies with part 15 of the fcc rules. operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation
bm70/bm71 ds60001372d-page 54 ? 2015-2016 microchip technology inc. a user's manual for the finished product should include the following statement: additional information on labeling and user information requirements for part 15 devices can be found in kdb publication 784748, which is available at the fcc office of engineering and technology (oet) labora- tory division knowledge database (kdb) http://apps.fcc.gov/oetcf/kdb/index.cfm . a.1.3 rf exposure all transmitters regulated by fcc must comply with rf exposure requirements. kdb 447498 general rf exposure guidance provides guidance in determining whether proposed or existing transmitting facilities, operations or devices comply with limits for human exposure to radio frequency (rf) fields adopted by the federal communications commission (fcc). from the fcc grant: output power listed is conducted. this grant is valid only when the module is sold to oem integrators and must be installed by the oem or oem integrators. this transmitter is restricted for use with the specific antenna(s) tested in this application for certification and must not be co-located or operating in conjunction with any other antenna or transmitters within a host device, except in accordance with fcc multi-transmitter product procedures. this module is approved for installation into mobile or/and portable host platforms a.1.4 helpful web sites federal communications commission (fcc): http://www.fcc.gov fcc office of engineering and technology (oet) lab- oratory division knowledge database (kdb): http://apps.fcc.gov/oetcf/kdb/index.cfm . a.2 canada the bm70/bm71 has been certified for use in canada under industry canada (ic) radio standards specifica- tion (rss) rss-247 and rss-gen. modular approval permits the installation of a module in a host device without the need to recertify the device. a.2.1 labeling and user information requirements labeling requirements for the host device (from sec- tion 3.1, rss-gen, issue 4, november 2014): the host device shall be properly labeled to identify the module within the host device. on bm71, due to the limited module size (9.0 mm x 11.5 mm) the ic identifier is displayed in the data sheet only and can not be displayed on the mod- ule label. the industry canada certification label of a module shall be clearly visible at all times when installed in the host device, otherwise the host device must be labeled to display the industry canada certification number of the module, preceded by the words "contains transmit- ter module", or the word "contains", or similar wording expressing the same meaning, as follows: for the bm70: for the bm71: user manual notice for license-exempt radio appara- tus (from section 8.4, rss-gen, issue 4, november 2014): user manuals for license-exempt radio appara- tus shall contain the following or equivalent notice in a conspicuous location in the user manual or alterna- tively on the device or both: this equipment has been tested and found to comply with the limits for a class b digital device, pursuant to part 15 of the fcc rules. these limits are designed to provide reasonable protection against harmful interference in a residential installation. this equip- ment generates, uses and can radiate radio fre- quency energy, and if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. however, there is no guarantee that interference will not occur in a particular installation. if this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the follow- ing measures: reorient or relocate the receiving antenna. increase the separation between the equipment and receiver. connect the equipment into an outlet on a circuit different from that to which the receiver is con- nected. consult the dealer or an experienced radio/tv technician for help. contains transmitter module ic: 12246a-bm70bles1f2 contains transmitter module ic: 12246a-bm71s2 this device complies with industry canada license-exempt rss standard(s). operation is sub- ject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. le prsent appareil est conforme aux cnr d'indus- trie canada applicables aux appareils radio exempts de licence. l'exploitation est autorise aux deux con- ditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement.
? 2015-2016 microchip technology inc. ds60001372d-page 55 bm70/bm71 transmitter antenna (from section 8.3, rss-gen, issue 4, november 2014): user manuals for transmit- ters shall display the following notice in a conspicuous location: the preceding notice may be affixed to the device instead of displayed in the user manual. a.2.2 rf exposure all transmitters regulated by ic must comply with rf exposure requirements listed in rss-102 - radio fre- quency (rf) exposure compliance of radio communi- cation apparatus (all frequency bands). a.2.3 helpful web sites industry canada: http://www.ic.gc.ca/ a.3 europe the bm70/bm71 is an r&tte directive assessed radio module that is ce marked and has been manu- factured and tested with the intention of being inte- grated into a final product. the bm70/bm71 has been tested to r&tte directive 1999/5/ec essential requirements for health and safety (article (3.1(a)), electromagnetic compatibility (emc) (article 3.1(b)), and radio (article 3.2) and are summarized in table a-1 / tab le a - 2 . a notified body opinion has also been issued. the r&tte compliance association provides guid- ance on modular devices in the document technical guidance note 01? which is available for download from the following location: http://www.rtteca.com/html/download_area.htm . a.3.1 labeling and user information requirements the label on the final product which contains the bm70/bm71 must follow ce marking requirements. the r&tte compliance association technical guid- ance note 01 provides guidance on final product ce marking. a.3.2 antenna requirements from the r&tte compliance association document technical guidance note 01. under industry canada regulations, this radio trans- mitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the trans- mitter by industry canada. to reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotrop- ically radiated power (e.i.r.p.) is not more than that necessary for successful communication. conformment la rglementation d'industrie can- ada, le prsent metteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou infrieur) approuv pour l'metteur par industrie can- ada. dans le but de rduire les risques de brouillage radiolectrique l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonne quivalente (p.i.r.e.) ne dpasse pas l'intensit ncessaire l'tablisse- ment d'une communication satisfaisante. to maintain conformance to the testing listed in table a-1 / tab le a - 2 : european compliance testing, the module shall be installed in accordance with the installation instructions in this data sheet and shall not be modified. when integrating a radio module into a completed product the integrator becomes the manufacturer of the final product and is therefore responsible for demonstrating compliance of the final product with the essential requirements of the r&tte directive. provided the integrator installing an assessed radio module with an integral or specific antenna and installed in conformance with the radio module man- ufacturer's installation instructions requires no further evaluation.under article 3.2 of the r&tte directive and does not require further involvement of an r&tte directive notified body for the final product. [section 2.2.4]
bm70/bm71 ds60001372d-page 56 ? 2015-2016 microchip technology inc. the european compliance testing listed in ta bl e a - 1 and tab le a - 2 were performed using the integral ceramic chip antenna. a.3.3 helpful web sites a document that can be used as a starting point in understanding the use of short range devices (srd) in europe is the european radio communications committee (erc) recommendation 70-03 e, which can be downloaded from the european radio commu- nications office (ero) at: http://www.ero.dk/ . addi- tional helpful web sites are: radio and telecommunications terminal equip- ment (r&tte): http://ec.europa.eu/enterprise/rtte/index_en.htm european conference of postal and telecommu- nications administrations (cept): http://www.cept.org european telecommunications standards insti- tute (etsi): http://www.etsi.org european radio communications office (ero): http://www.ero.dk the radio and telecommunications terminal equipment compliance association (r&tte ca): http://www.rtteca.com a.4 japan the bm70/bm71 has received type certification and is labeled with its own technical conformity mark and cer- tification number as required to conform to the techni- cal standards regulated by the ministry of internal affairs and communications (mic) of japan pursuant to the radio act of japan. integration of this module into a final product does not require additional radio certification provided installa- tion instructions are followed and no modifications of the module are allowed. additional testing may be required: if the host product is subject to electrical appli- ance safety (for example, powered from an ac mains), the host product may require product safety electrical appliance and material (pse) testing. the integrator should contact their confor- mance laboratory to determine if this testing is required. there is an voluntary electromagnetic compatibil- ity (emc) test for the host product administered by vcci: http://www.vcci.jp/vcci_e/index.html table a-1: european compliance testing (bm70) certification standards article laboratory report number safety en60950-1:2006/a11:2009/a1:2010/ a12:2011/a2:2013 [3.1(a)] tuv rheinland 10051261 003 health en62479:2010 10053580 001 emc en301489-1 v1.9.2 [3.1(b)] 10051137 002 en301489-17 v2.2.1 radio en300328 v1.9.1 (3.2) 10053580 001 notified body opinion 10048935 001 table a-2: european compliance testing (bm71) certification standards article laboratory report number safety en60950-1:2006/a11:2009/a1:2010/ a12:2011/a2:2013 [3.1(a)] tuv rheinland 10053210 001 health en62479:2010 10053433 001 emc en301489-1 v1.9.2 [3.1(b)] 10052964 001 en301489-17 v2.2.1 radio en300328 v1.9.1 (3.2) 10053433 001 notified body opinion 10048936 001
? 2015-2016 microchip technology inc. ds60001372d-page 57 bm70/bm71 a.4.1 labeling and user information requirements the label on the final product which contains the bm70/bm71 must follow japan marking requirements. the integrator of the module should refer to the labeling requirements for japan available at the ministry of internal affairs and communications (mic) website. the bm70 is labeled with its own technical conformity mark and certification number. the final product in which this module is being used must have a label referring to the type certified module inside: on bm71, due to the limited module size (9.0 mm x 11.5 mm) the japan identifier is displayed in the data sheet only and can not be displayed on the module label. the final product in which this module is being used must have a label referring to the type certified module inside: a.4.2 helpful web sites ministry of internal affairs and communications (mic): http://www.tele.soumu.go.jp/e/index.htm association of radio industries and businesses (arib): http://www.arib.or.jp/english/ a.5 korea the bm70/bm71 has received certification of confor- mity in accordance with the radio waves act. integra- tion of this module into a final product does not require additional radio certification provided installation instructions are followed and no modifications of the module are allowed. a.5.1 labeling and user information requirements the label on the final product which contains the bm70/bm71 must follow kc marking requirements. the integrator of the module should refer to the labeling requirements for korea available on the korea com- munications commission (kcc) website. the bm70 module is labeled with its own kc mark. the final product requires the kc mark and certificate num- ber of the module: on the bm71, due to the limited module size (9.0 mm x 11.5 mm) the kc mark and identifier is dis- played in the data sheet only and can not be displayed on the module label. the final product requires the kc mark and certificate number of the module: a.5.2 helpful web sites korea communications commission (kcc): http://www.kcc.go.kr national radio research agency (rra): http://rra.go.kr a.6 taiwan the bm70/bm71 has received compliance approval in accordance with the telecommunications act. custom- ers seeking to use the compliance approval in their product should contact microchip technology sales or distribution partners to obtain a letter of authority. integration of this module into a final product does not require additional radio certification provided installa- tion instructions are followed and no modifications of the module are allowed. a.6.1 labeling and user information requirements the bm70 is labeled with its own ncc mark and certif- icate number as follows: on the bm71, due to the limited module size (9.0 mm x 11.5 mm) the ncc mark and identifier is dis- played in the data sheet only and can not be displayed on the module label. the user's manual should contain following warning (for rf device) in traditional chinese: ? ! ???Ck ?l ?JC??l?C?S ??????l?? ??O? ??
bm70/bm71 ds60001372d-page 58 ? 2015-2016 microchip technology inc. ??l l?C???w? ?_???lF?_Fr??Ko?_r ^m? ???????I?o l?C??????I?Wt ?? ?CO??_ a.6.2 helpful web sites national communications commission (ncc): http://www.ncc.gov.tw a.7 china the bm70 has received certification of conformity in accordance with the china miit notice 2014-01 of state radio regulation committee (srrc) certifica- tion scheme. integration of this module into a final prod- uct does not require additional radio certification, provided installation instructions are followed and no modifications of the module are allowed. a.7.1 labeling and user information requirements the bm70 module is labeled with its own cmiit id as follows: when host system is using an approved full modular approval (fma) radio: the host must carry a label con- taining the statement this device contains srrc approved radio module cmiit id: 2015dj7135. a.8 other regulatory jurisdictions should other regulatory jurisdiction certification be required by the customer, or the customer need to recertify the module for other reasons, contact micro- chip for the required utilities and documentation.
? 2015-2016 microchip technology inc. ds60001372d-page 59 bm70/71 appendix b: revision history b.1 revision a (october 2015) this is the initial released version of the document. b.2 revision b (october 2015) this revision includes the following changes as well as minor updates to text and formatting, which were incorporated throughout the document. table b-1: major section updates revision c (november 2015) updated appendix a: ?certification notices? . revision d (march 2016) this revision includes the following changes as well as minor updates to text and formatting, which were incorporated throughout the document. section update description section ?features? this section is updated with certification informations. the data from this section has been reformatted and distributed in other sec- tions. section ?mac/baseband/higher layer fea- tures? , section ?power management? , ?operating conditions? ,and section ?antenna? these sections are newly added. section ?general description? this section was previously placed in chapter 1 and has been moved here. section 1.0 ?device overview? ta b l e 1 - 2 , tab l e 1 - 4 , and ta b l e 1 - 5 are added. section 2.0 ?application information? this chapter contains information that was previously located in appendix a and electrical characteristics. section 8.0 ?ordering guide? ta b l e 8 - 1 is updated with y-axis information and certification infor- mation. section appendix b: ?revision history? this section is updated with images for the certification marking and their numbers. the regulatory information is updated to be the latest. section 5.0 ?electrical characteristics? ta b l e 5 - 3 is added section update description 1.1 ?interface description? this section is updated with a note. updated figure 1-1 , figure 1-2 , figure 1-6 2.1 ?reference schematics? figure 2-1 through figure 2-8 , figure 2-10 , figure 5-1 , figure 5-2 , figure 2-11 , figure 4-1 and ta bl e 4 - 1 , tab l e 8 - 1 5.1 ?absolute maximum ratings? updated this section. 5.2.1 ?tx/rx current consumption details? updated this section with new content. 8.0 ?ordering guide? this section is updated with a note. appendix a: ?certification notices? content has been updated
bm70/71 ds60001372d-page 60 ? 2015-2016 microchip technology inc. notes:
? 2015-2016 microchip technology inc. ds60001372d-page 61 bm70/71 the microchip web site microchip provides online support via our www site at www.microchip.com . this web site is used as a means to make files and information easily available to customers. accessible by using your favorite internet browser, the web site contains the following information: product support C data sheets and errata, application notes and sample programs, design resources, users guides and hardware support documents, latest software releases and archived software general technical support C frequently asked questions (faq), technical support requests, online discussion groups, microchip consultant program member listing business of microchip C product selector and ordering guides, latest microchip press releases, listing of seminars and events, listings of microchip sales offices, distributors and factory representatives customer change notification service microchips customer notification service helps keep customers current on microchip products. subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. to register, access the microchip web site at www.microchip.com . under support, click on customer change notification and follow the registration instructions. customer support users of microchip products can receive assistance through several channels: distributor or representative local sales office field application engineer (fae) technical support customers should contact their distributor, representative or field application engineer (fae) for support. local sales offices are also available to help customers. a listing of sales offices and locations is included in the back of this document. technical support is available through the web site at: http://microchip.com/support
bm70/71 ds60001372d-page 62 ? 2015-2016 microchip technology inc. notes:
? 2015-2016 microchip technology inc. ds60001372d-page 63 information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. it is your responsibility to ensure that your application meets with your specifications. microchip makes no representations or warranties of any kind whether express or implied, written or oral, statutory or otherwise, related to the information, including but not limited to its condition, quality, performance, merchantability or fitness for purpose . microchip disclaims all liability arising from this information and its use. use of microchip devices in life support and/or safety applications is entirely at the buyers risk, and the buyer agrees to defend, indemnify and hold harmless microchip from any and all damages, claims, suits, or expenses resulting from such use. no licenses are conveyed, implicitly or otherwise, under any microchip intellectual property rights unless otherwise stated. trademarks the microchip name and logo, the microchip logo, anyrate, dspic, flashflex, flexpwr, heldo, jukeblox, keeloq, keeloq logo, kleer, lancheck, link md, medialb, most, most logo, mplab, optolyzer, pic, picstart, pic32 logo, righttouch, spynic, sst, sst logo, superflash and uni/o are registered trademarks of microchip technology incorporated in the u.s.a. and other countries. clockworks, the embedded control solutions company, ethersynch, hyper speed control, hyperlight load, intellimos, mtouch, precision edge, and quiet-wire are registered trademarks of micr ochip technology incorporated in the u.s.a. analog-for-the-digital age, any capacitor, anyin, anyout, bodycom, chipkit, chipkit logo, codeguard, dspicdem, dspicdem.net, dynamic average matching, dam, ecan, ethergreen, in-circuit serial programming, icsp, inter-chip connectivity, jitterblocker, kleernet, kleernet logo, miwi, motorbench, mpasm, mpf, mplab certified logo, mplib, mplink, multitrak, netdetach, omniscient code generation, picdem, picdem.net, pickit, pictail, puresilicon, righttouch logo, real ice, ripple blocker, serial quad i/o, sqi, superswitcher, superswitcher ii, total endurance, tsharc, usbcheck, varisense, viewspan, wiperlock, wireless dna, and zena are trademarks of microchip technology incorporated in the u.s.a. and other countries. sqtp is a service mark of mi crochip technology incorporated in the u.s.a. silicon storage technology is a registered trademark of microchip technology inc. in other countries. gestic is a registered tradem arks of microchip technology germany ii gmbh & co. kg, a subsidiary of microchip technology inc., in other countries. all other trademarks mentioned herein are property of their respective companies. ? 2015-2016, microchip technology incorporated, printed in the u.s.a., all rights reserved. isbn:978-1-5224-0410-1 note the following details of the code protection feature on microchip devices: microchip products meet the specification cont ained in their particular microchip data sheet. microchip believes that its family of products is one of the most secure families of its kind on the market today, when used i n the intended manner and under normal conditions. there are dishonest and possibly illegal methods used to breach the code protection feature. all of these methods, to our knowledge, require using the microchip products in a manner outside the operating specif ications contained in microchips data sheets. most likely, the person doing so is engaged in theft of intellectual property. microchip is willing to work with the customer who is concerned about the integrity of their code. neither microchip nor any other semiconduc tor manufacturer can guarantee the security of their code. code protection does not mean that we are guaranteeing the product as unbreakable. code protection is constantly evolving. we at microchip are co mmitted to continuously improvin g the code protection features of our products. attempts to break microchips code protection feature may be a violation of the digital millennium copyright act. if such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that act. microchip received iso/ts-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in chandler and tempe, arizona; gresham, oregon and design centers in california and india. the company?s quality system processes and procedures are for its pic ? mcus and dspic ? dscs, k ee l oq ? code hopping devices, serial eeproms, microperipherals, nonvolatile memory and analog products. in addition, microchip?s quality system for the design and manufacture of development systems is iso 9001:2000 certified. quality management s ystem certified by dnv == iso/ts 16949 ==
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